Study on the transformation and control mechanism of amorphous damage during the grinding process of monocrystalline silicon considering grain shapes by MD method
Release Time:2024-06-13 Hits:
Indexed by: Journal Papers
Document Code: 370661
Date of Publication: 2023-09-18
Journal: TRIBOLOGY INTERNATIONAL
Volume: 187
ISSN: 0301-679X
Key Words: DEFORMATION; EDGE RADIUS; MOLECULAR-DYNAMICS SIMULATION; PARTICLE-SHAPE; REMOVAL MECHANISM; SCALE; SINGLE-CRYSTAL SILICON; SUBSURFACE DAMAGE; SURFACE; TRANSITION