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Variable convolution-based prediction of surface profiles in polishing pad conditioning

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Date of Publication:2025-10-24

Journal:PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Volume:97

Page Number:279-289

ISSN No.:0141-6359

Key Words:CMP; DIAMOND SIZE; MATERIAL REMOVAL; UNIFORMITY; WAFER; WEAR

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