Variable convolution-based prediction of surface profiles in polishing pad conditioning
Release Time:2025-11-17 Hits:
Date of Publication: 2025-10-24
Journal: PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume: 97
Page Number: 279-289
ISSN: 0141-6359
Key Words: CMP; DIAMOND SIZE; MATERIAL REMOVAL; UNIFORMITY; WAFER; WEAR