Hits:
Indexed by:Journal Papers
Date of Publication:2019-01-01
Journal:Precision Engineering
Included Journals:SCI、EI
Volume:55
Page Number:70-76
Pre One:Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)
Next One:Analytical Elastic Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
