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Indexed by:期刊论文

Date of Publication:2011-05-01

Journal:CORROSION SCIENCE

Included Journals:SCIE、EI

Volume:53

Issue:5

Page Number:1738-1747

ISSN No.:0010-938X

Key Words:Electronic materials; Tin; Acid corrosion; Alkaline corrosion

Abstract:Leaching behavior of heavy metal elements from Sn-3.5Ag-0.5Cu, Sn-9Zn, and Sn-37Pb solder alloys and their joints was investigated in typical H(2)SO(4), NaCl and NaOH solutions. The leaching amount of Sn from solder joints was more than that from solder alloys and the leaching amount of Sn from Sn-3.5Ag-0.5Cu solder joint in the NaCl solution was the most. The surface corrosion products on the solder and their joints were composed of oxide, oxide hydroxide or oxychloride of the component element. Much more surface oxides for the samples treated in the NaCl solution produced than that in the NaOH and H(2)SO(4) solutions. (c) 2011 Elsevier Ltd. All rights reserved.