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Indexed by:期刊论文

Date of Publication:2009-07-15

Journal:MATERIALS LETTERS

Included Journals:SCIE、EI

Volume:63

Issue:17

Page Number:1478-1480

ISSN No.:0167-577X

Key Words:High magnetic field; Intermetallic compound; (Cu, Ni)(6)Sn-5; Microstructure; Ni content

Abstract:The effect of high magnetic field on the microstructure of (Cu, Ni)(6)Sn-5 intermetallic compound layer in Sn0.3Ni/Cu couples at 250 degrees C was examined. The applied magnetic field changed the morphology of outer (Cu, Ni)(6)Sn-5 crystals on the Sn side from faceted shape to stick shape. The high magnetic field affected the crystal orientations of (Cu, Ni)(6)Sn-5 and reduced the Ni content in the outer layer. The morphology evolution of (Cu, Ni)(6)Sn-5 is attributed to the content of Ni solute decreased by magnetic field. The effects of high magnetic field on the liquid convection and phase diagram are considered to be responsible for the Ni content. (C) 2009 Elsevier B.V. All rights reserved.