Current position: Home >> Scientific Research >> Paper Publications

Warping of silicon wafers subjected to back-thinning process

Release Time:2019-03-12  Hits:

Indexed by: Journal Article

Date of Publication: 2015-01-01

Journal: Precision Engineering

Volume: 40

Issue: -

Page Number: 87-93

Prev One:带中心孔的复合超声变幅杆设计及性能分析

Next One:Topology optimization-based lightweight primary mirror design of a large-aperture space telescope
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep