location： Current position: Home >> Scientific Research >> Paper Publications

Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers

Hits:

Indexed by:会议论文

Date of Publication:2018-01-01

Pre One:Study on Electrochemical Effect in Electrochemical Grinding of Tungsten Alloy

Next One:6th International Conference on Nanomanufacturing
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep