Hits:
Indexed by:期刊论文
Date of Publication:2022-07-01
Journal:计算力学学报
Affiliation of Author(s):运载工程与力学学部
Volume:27
Issue:4
Page Number:590-595
ISSN No.:1007-4708
Pre One:晶圆级芯片尺寸封装Sn-3.0Ag-0.5Cu 焊点跌落失效模式
Next One:求解粘弹性问题的时域自适应等几何比例边界有限元分析
