晶圆级芯片尺寸封装Sn-3.0Ag-0.5Cu 焊点跌落失效模式
Release Time:2023-08-11 Hits:
Indexed by: Journal Article
Date of Publication: 2022-07-01
Journal: Transactions of Nonferrous Metals Society of China
Institution: 材料科学与工程学院
Volume: 26
Issue: 6
Page Number: 1663-1669
ISSN: 1003-6326