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晶圆级芯片尺寸封装Sn-3.0Ag-0.5Cu 焊点跌落失效模式

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Indexed by:期刊论文

Date of Publication:2022-07-01

Journal:Transactions of Nonferrous Metals Society of China

Affiliation of Author(s):材料科学与工程学院

Volume:26

Issue:6

Page Number:1663-1669

ISSN No.:1003-6326

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