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Indexed by:期刊论文

Date of Publication:2013-01-01

Journal:ECS ELECTROCHEMISTRY LETTERS

Included Journals:SCIE、EI、Scopus

Volume:2

Issue:7

Page Number:C23-C26

ISSN No.:2162-8726

Abstract:This work presents a self-healing anticorrosive coating for copper. The 3Dporous copper structure prepared by electrodeposition using hydrogen bubbles as template is used as reservoir for encapsulation of corrosion inhibitor. Defects in the coating trigger a rapid release of encapsulated inhibitor, which confers self-healing properties on the coating. After being scratched with a knife-edge, the composite coating rapidly releases inhibitor embedded in 3D porous film to suppress the corrosion process. The scratch on the coating is covered with inhibitor adsorption film and corrosion products are not found. (C) 2013 The Electrochemical Society. All rights reserved.