Release Time:2019-04-19 Hits:
First Author: Li Jingmin
Disigner of the Invention: Chong Liu,梁超,王帅,刘子扬
Authorization Number: ZL201610569113.2
Prev One:一种基于激光重铸物微导能筋的超声封合方法
Next One:一种无源微阀POCT芯片