Release Time:2019-04-19 Hits:
First Author: Li Jingmin
Disigner of the Invention: 王立鼎,刘军山,孟凡建,Chong Liu,梁超
Authorization Number: ZL201611138289.9
Prev One:一种用于聚合物芯片的超声波精密焊接的压力自调平装置
Next One:一种具有特异构型微通道的POCT芯片