Current position: Home >> Scientific Research >> Patents

一种用于聚合物芯片的超声波精密焊接的压力自调平装置

Release Time:2019-10-20  Hits:

First Author: Li Jingmin

Disigner of the Invention: 梁超,孟凡健,Chong Liu

Application Number: CN201710188608.5

Authorization Date: 2017-03-28

Authorization Number: CN107042129A

Prev One:一种梳齿式微流体延时器

Next One:一种基于激光重铸物微导能筋的超声封合方法
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep