Release Time:2022-10-20 Hits:
First Author: Li Jingmin
Disigner of the Invention: Chong Liu,刘子扬,梁超,张斌,liyang
Institution: 机械工程学院
Application Number: CN106093382A
Authorization Number: CN201610566746.8
Prev One:一种具有特异构型微通道的POCT芯片
Next One:一种用于聚合物芯片的超声波精密焊接的压力自调平装置