Hits:
First Author:Li Jingmin
Disigner of the Invention:郭利华,时伟平,Chong Liu
Affilication of Author(s):机械工程学院
Application Number:CN105342670A
Authorization number:CN201510618435.7
Pre One:一种用于聚合物芯片的超声波精密焊接的压力自调平装置
Next One:一种POCT即时检测芯片产品快速柔性粘接封合机