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一种用于聚合物芯片的超声波精密焊接的压力自调平装置

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First Author:Li Jingmin

Disigner of the Invention:Chong Liu,孟凡健,梁超

Affilication of Author(s):机械工程学院

Application Number:CN107042129A

Authorization number:CN201710188608.5

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