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一种用于聚合物芯片的超声波精密焊接的压力自调平装置

Release Time:2022-10-19  Hits:

First Author: Li Jingmin

Disigner of the Invention: Chong Liu,孟凡健,梁超

Institution: 机械工程学院

Application Number: CN107042129A

Authorization Number: CN201710188608.5

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