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论文类型：期刊论文

发表时间：2015-04-01

发表刊物：INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

收录刊物：SCIE、EI、Scopus

卷号：78

期号：1-4

页面范围：177-187

ISSN号：0268-3768

关键字：Dynamic injection molding technology; Warpage optimization; Kriging surrogate model; Expected improvement method; Sequential optimization

摘要：Warpage is one of the serious defects for thin wall plastic injected component. This paper employs dynamic filling and packing process parameters as the new design variables to perform the optimization on warpage for the first time. In this paper, several numerical implementations for dynamic filling and packing are discussed in detail. The unclear functional relationship between the objective (maximum warpage) and 12 process parameters is characterized by the Kriging surrogate model approximately. These process parameters not only include the conventional process parameters, like melt temperature, filling time, packing pressure etc., but also include the new dynamic process parameters involving amplitude, frequency, and phase of vibration. Subsequently, the efficient global optimization method (expected improvement-based method) is used for searching the optimum solution sequentially. Final results suggest a set of process parameters of the dynamic injection molding technology with which the maximum warpage of a plastic part is greatly reduced. By comparison with the corresponding conventional injection, injecting pressure of the optimized system fluctuates with the same frequency as dynamic flow rate during filling, which plays a significant role for the warpage reduction.