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论文类型：期刊论文

发表时间：2017-05-01

发表刊物：CHINA FOUNDRY

收录刊物：SCIE、Scopus

卷号：14

期号：3

页面范围：194-198

ISSN号：1672-6421

关键字：Al-Cu clad materials; interface; solid-liquid method; microstructure

摘要：The solid-liquid method was used to prepare the continuous casting of copper cladding aluminium by liquid aluminum alloy and solid copper, and the interfacial phase formation of Al-Cu bimetal at different pouring temperatures (700, 750, 800 degrees C) was investigated by means of metallograph, scanning electron microscopy (SEM) and energy dispersive spectrometry (EDS) methods. The results showed that the pouring temperature of aluminum melt had an important influence on the element diffusion of Cu from the solid Cu to Al alloy melt and the reactions between Al and Cu, as well as the morphology of the Al-Cu interface. When the pouring temperature was 800 degrees C, there were abundant Al-Cu intermetallic compounds (IMCs) near the interface. However, a lower pouring temperature (700 degrees C) resulted in the formation of cavities which was detrimental to the bonding and mechanical properties. Under the conditions in this study, the good metallurgical bonding of Al-Cu was achieved at a pouring temperature of 750 degrees C.