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Indexed by:期刊论文

Date of Publication:2017-10-13

Journal:NANOTECHNOLOGY

Included Journals:Scopus、SCIE、EI、PubMed

Volume:28

Issue:41

Page Number:415705

ISSN No.:0957-4484

Key Words:nanoscale multilayered metallic material; nanoscale twin; cube-on-cube hetero interface; hetero-twin interface; strength; molecular dynamics simulation

Abstract:Based on molecular dynamics simulations, tensile mechanical properties and plastic deformation mechanisms of nano-twinned Cu//Ag multilayered materials are investigated in this work. Simulation results show that, due to the stronger strengthening effect of the twin boundary than both the cube-on-cube and hetero-twin interfaces between Cu and Ag layers, the strength increases with the increase of layer thickness for nano-twinned Cu//Ag multilayered materials with a constant twin spacing, while it decreases with the increase of layer thickness for twin-free ones. The strength of hetero-twin multilayered materials is higher than that of the cube-on-cube samples due to the different hetero interfacial configurations. The confined layer slip of dislocation is found to be the dominant plastic deformation mechanism for twin-free hetero-twin multilayered materials and the strength versus twin spacing in nano-twinned samples follows the conventional Hall-Petch relationship. These findings will shed light on the understanding of the plastic deformation mechanisms and the fabrication of high strength nano-twinned multilayered metallic materials.