Release Time:2023-01-08 Hits:
Date of Publication: 2022-10-05
Journal: Scientific Reports
Institution: 电子信息与电气工程学部
Volume: 6
Issue: 1
Page Number: 1892101-1892110
Prev One:A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss and high bonding strength
Next One:A novel 2D silicon nano-mold fabrication technique for linear nanochannels over a 4 inch diameter substrate