Current position: Home >> Scientific Research >> Paper Publications

Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

Release Time:2022-10-14  Hits:

Date of Publication: 2022-10-08

Journal: INTERMETALLICS

Institution: 机械工程学院

Volume: 93

Page Number: 186-196

ISSN: 0966-9795

Prev One:Recurrent neural networks for real-time prediction of TBM operating parameters

Next One:Sensitivity analysis and reliability based design optimization for high-strength steel tailor welded thin-walled structures under crashworthiness
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep