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Date of Publication:2022-10-08
Journal:AUTOMATION IN CONSTRUCTION
Volume:98
Page Number:225-235
ISSN No.:0926-5805
Pre One:Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn under Thermal Gradient
Next One:Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
