Hits:
Date of Publication:2022-10-08
Journal:2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
Affiliation of Author(s):机械工程学院
Page Number:1502-1507
Pre One:Questionnaire-Based Discussion of Finite Element Multiphysics Simulation Software in Power Electronics
Next One:Recurrent neural networks for real-time prediction of TBM operating parameters