Release Time:2019-03-10  Hits:

Indexed by: Conference Paper

Date of Publication: 2016-08-16

Included Journals: Scopus、SCIE、CPCI-S、EI

Page Number: 608-611

Key Words: Soldering; Synchrotron radiation; Intermetallic compounds; Thermal conductivity; Finite element analysis

Abstract: Synchrotron radiation x-ray imaging technique was applied for in-situ observation of interfacial bubbles in Cu/molten Sn-3.5Ag/Cu joint undergoing thermomigration. The heating plate temperature was maintained at 350 degrees C and reflow time of 1 h was considered. Interfacial bubbles at hot side, favoured by wetting transition for growth, increase the effective thermal gradient in the solder medium. The interfacial voids lower the resistance of Sn-based solder joints to thermomigration. The numerical model for effective thermal conductivity and heat transfer in the inhomogeneous medium was implemented using finite element method.