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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[1]Ma, H. R., Dong, C., Zhao, N., Wang, Y. P., Li, X. G., H. T., Chen, J., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
[2]Qiao, Y. Y., Zhao, N., Liu, C. Y., Wu, C. M. L., Wang, Y. P., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates ...[J],MATERIALS TODAY COMMUNICATIONS,2020,23
[3]Gao, Zhaoqing, Cao, Jinwei, Muzammal , Hussain Muhammad, Wang, Chen, Sun, Hao, Dong, Chong, Ma, Haitao, Yunpeng, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly...[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
[4]Zhu, Zhidan, Ma, Haoran, Shang, Shengyan, Haitao, Wang, Yunpeng, Li, Xiaogan, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Ma, HR (reprint author), Sch Microelect.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interfac...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
[5]Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Ma, Haitao, Wang, Yunpeng, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints r...[J],THIN SOLID FILMS,2019,669:198-207
[6]Zhong, Y., Zhao, N., Dong, W., Wang, Y. P., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/...[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
[7]Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Wang, Yunpeng, Zhao, Ning, Huang, Mingliang, Ma, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
[8]Shang, Shengyan, Kunwar, Anil, Wang, Yanfeng, Qi, Xiao, Ma, Haitao, Yunpeng, HT, Wang, YP (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synthesis of Cu@Ag core-shell nanoparticles for characterization of thermal stability and elect...[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2018,124(7)
[9]Ma, H. R., Kunwar, A., Shang, S. Y., Jiang, C. R., Wang, Y. P., H. T., Zhao, N., HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during mul...[J],INTERMETALLICS,2018,96:1-12
[10]Ma, Haoran, Kunwar, Anil, Chen, Jun, Qu, Lin, Wang, Yunpeng, Song, Xueguan, Haitao, Zhao, Ning, Raback, Peter, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205

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