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Detection of subsurface microcracks after grinding of single crystal silicon wafer by polarized laser scattering [偏振激光散射检测单晶硅片磨削后的亚表面微裂纹]

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Date of Publication:2022-10-02

Journal:Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering

Volume:40

Issue:4

Page Number:87-92

ISSN No.:1006-852X

Key Words:"Damage detection; Non-damage detection; Silicon wafer; Subsurface microcrack"

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