Detection of subsurface microcracks after grinding of single crystal silicon wafer by polarized laser scattering [偏振激光散射检测单晶硅片磨削后的亚表面微裂纹]
Release Time:2023-03-09 Hits:
Date of Publication: 2022-10-02
Journal: Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering
Volume: 40
Issue: 4
Page Number: 87-92
ISSN: 1006-852X
Key Words: "Damage detection; Non-damage detection; Silicon wafer; Subsurface microcrack"