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Date of Publication:2022-10-09
Journal:航空学报
Volume:39
Issue:12
Page Number:358-369
ISSN No.:1000-6893
Note:新增回溯数据
Pre One:Detection of subsurface microcracks after grinding of single crystal silicon wafer by polarized laser scattering [偏振激光散射检测单晶硅片磨削后的亚表面微裂纹]
Next One:Formation of subsurface cracks in silicon wafers by grinding
