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Indexed by:期刊论文

Date of Publication:2010-11-01

Journal:APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Included Journals:SCIE、EI、Scopus

Volume:101

Issue:3,SI

Page Number:517-521

ISSN No.:0947-8396

Abstract:Based on the requirements for silicon sheets with different thickness in MEMS, and according to the experimental results, the element of the temperature distribution was investigated by calculation with ANSYS, and the bending mechanism of different thicknesses of the silicon sheet is proposed. The results showed that the plastic deformation was delayed as the thickness is increased. The bending angle was bigger with the increment being smaller as the scanning numbers increased, and the biggest bending angle was obtained finally.