Current position: Home >> Scientific Research >> Patents

一种薄硅片的弯曲成形方法

Hits:

First Author:WU Dongjiang

Disigner of the Invention:Ma Guangyi,Dongming Guo,刘双

Application Number:CN201010601561.9

Authorization Date:2010-12-23

Authorization number:CN102070119A

Pre One:一种核主泵转子屏蔽套的真空热胀形工艺

Next One:一种核主泵屏蔽套的焊接方法