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修正基片晶面偏差的加工方法及夹具装置

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First Author:Renke Kang

Disigner of the Invention:liyan,HANG GAO,WU Dongjiang,Dongming Guo

Affilication of Author(s):机械工程学院

Application Number:CN101393856

Authorization number:CN200810228498.1

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