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Bonding mechanism of TC4 titanium alloy/T2 copper vacuum diffusion bonded joint with nickel as transition interlayer

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Date of Publication:2024-10-29

Journal:Journal of Manufacturing Processes

ISSN No.:1526-6125

Key Words:Bonding mechanism; Microstructure; Nickel interlayer; Shear strength; TC4 titanium alloy/T2 copper; Vacuum diffusion bonding

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