Bonding mechanism of TC4 titanium alloy/T2 copper vacuum diffusion bonded joint with nickel as transition interlayer
Release Time:2025-06-11 Hits:
Indexed by: Journal Papers
Document Code: 403260
Date of Publication: 2024-12-12
Journal: JOURNAL OF MANUFACTURING PROCESSES
Volume: 131
Page Number: 1309-1320
ISSN: 1526-6125
Key Words: EVOLUTION; METAL; MICROSTRUCTURE; STEEL; STRENGTH; TEMPERATURE; TI-6AL-4V