Current position: Dong Honggang >> Scientific Research >> Paper Publications

Bonding mechanism of TC4 titanium alloy/T2 copper vacuum diffusion bonded joint with nickel as transition interlayer

Release Time:2025-06-11  Hits:

Date of Publication: 2024-10-29

Journal: Journal of Manufacturing Processes

ISSN: 1526-6125

Key Words: Bonding mechanism; Microstructure; Nickel interlayer; Shear strength; TC4 titanium alloy/T2 copper; Vacuum diffusion bonding

Prev One:Bonding mechanism of TC4 titanium alloy/T2 copper vacuum diffusion bonded joint with nickel as transition interlayer

Next One:Ni-based diamond composite coatings: preparation process, microstructure, properties and interfacial behavior
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep