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Bonding mechanism of TC4 titanium alloy/T2 copper vacuum diffusion bonded joint with nickel as transition interlayer

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Date of Publication:2024-10-23

Journal:JOURNAL OF MANUFACTURING PROCESSES

Volume:131

Page Number:1309-1320

ISSN No.:1526-6125

Key Words:EVOLUTION; METAL; MICROSTRUCTURE; STEEL; STRENGTH; TEMPERATURE; TI-6AL-4V

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