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Bonding mechanism of TC4 titanium alloy/T2 copper vacuum diffusion bonded joint with nickel as transition interlayer

Release Time:2025-06-11  Hits:

Date of Publication: 2024-10-23

Journal: JOURNAL OF MANUFACTURING PROCESSES

Volume: 131

Page Number: 1309-1320

ISSN: 1526-6125

Key Words: EVOLUTION; METAL; MICROSTRUCTURE; STEEL; STRENGTH; TEMPERATURE; TI-6AL-4V

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