Release Time:2019-10-19 Hits:
First Author: 张宇
Disigner of the Invention: 董闯,董红刚,王清,马启慧
Application Number: CN201711265963.4
Authorization Date: 2017-12-05
Authorization Number: CN107904447A
Prev One:一种基于团簇加连接原子模型的Co‑Al‑W基高温合金
Next One:一类镍基单晶高温合金Nideal 3