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Current position: Dong Honggang >> Scientific Research >> Patents

一种基于团簇加连接原子模型的Co‑Al‑W基高温合金

Release Time:2019-10-19  Hits:

First Author: 马启慧

Disigner of the Invention: 董闯,王清,张宇,董红刚

Application Number: CN201711088404.0

Authorization Date: 2017-11-08

Authorization Number: CN107828989A

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