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论文类型： 会议论文

发表时间： 2013-08-11

收录刊物： EI、CPCI-S、Scopus

页面范围： 264-267

关键字： lead-free solder; laser-soldering; IMC; interfacial reaction

摘要： The effect of the fiber laser soldering parameters, laser-soldering output power and laser-soldering scanning speed, respectively, on the Sn-Ag-Cu/Cu interfacial reaction was investigated in this paper. When the output energy was very low, the Cu6Sn5 IMC was in scallop type with smooth surface; as the energy increased, the Cu6Sn5 grains showed the morphology of scallop type grains with faceted surface; further grew the energy, the scallop-type of Cu6Sn5 would be replaced by the prism-type Cu6Sn5; the Cu6Sn5 grains which were bottom closely arranged with a convex on the top can be found if the laser soldering energy was up again; when the laser soldering energy increased again, the plate-like Cu6Sn5 can be observed at the interface between the solder and Cu substrate.