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发布时间：2019-03-11

论文类型：会议论文

发表时间：2013-08-11

收录刊物：Scopus、CPCI-S、EI

页面范围：400-402

关键字：Composite lead-free solder; Intermetallic compound; Growth kinetics

摘要：The growth kinetics and morphology of the interfacial intermetallic compound (IMC) Cu6Sn5 between Sn-3Ag-0.5Cu-xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate during aging were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 degrees C and then aged at 150 degrees C. The Fe element tended to suppress the growth of the Cu3Sn layer during solid-state aging. However, the total thickness of IMCs (Cu6Sn5 + Cu3Sn) for the composite solders with Fe particles was similar to that for SnAgCu without Fe particles.