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论文类型： 会议论文

发表时间： 2013-08-11

收录刊物： EI、CPCI-S、Scopus

页面范围： 382-+

关键字： fine pitch interconnect; Cu/Sn/Cu; interfacial reaction; intermetallic compound; growth kinetics

摘要： The interfacial reaction in Cu/Sn/Cu fine pitch interconnects during soldering at 250 degrees C was investigated in the present work. The morphological evolution and growth kinetics of the interfacial intermetallic compounds (IMCs) were studied. Cu6Sn5 scallops formed at the Sn/Cu interface and ripened with increasing reaction time. The dependence of average grain number on reaction time t followed t(-0.70) relationship. During the solid-liquid interfacial reaction, different growth behavior of interfacial Cu6Sn5 scallops presented between the direction vertical to the interface and that parallel to the interface. According to the ratio of R/H, the growth of interfacial Cu6Sn5 could be divided into three stages, i.e., the initial stage, the ripening stage and the thickening stage. The growth of Cu6Sn5 scallops was controlled by grain boundary diffusion, while that of Cu3Sn was controlled by volume diffusion.