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发布时间：2019-03-12

论文类型：期刊论文

发表时间：2017-08-01

发表刊物：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录刊物：Scopus、EI、SCIE

卷号：28

期号：15

页面范围：11192-11201

ISSN号：0957-4522

摘要：Novel Sn-rich Sn-Au-Ag solder alloys were designed based on the cluster-plus-glue-atom model and the [Sn11Au2]Sn-3 and [AuSn8]Au were applied as the basic cluster formulas. The microstructure, melting behavior, wettability and the interfacial reaction of the designed Sn-Au-Ag solders were systematically investigated. The Sn-Au-Ag solders designed based on the [Sn11Au2]Sn-3 cluster formula have a better ability to form the near-eutectic composition than those designed based on the [AuSn8]Au cluster formula. The [Sn11Au1Ag1]Sn-3 and [Sn11Au0.5Ag1.5]Sn-3 solders have near-eutectic compositions, with the melting temperatures of 206.89 and 207.25 A degrees C, respectively. While the Sn-Au-Ag solders designed based on the [AuSn8]Au cluster formula are non near-eutectics. The microstructure of the Sn-Au-Ag bulk solders consists of the AuSn4 and Ag3Sn phases dispersed in beta-Sn matrix. The Sn-Au-Ag solders have a better wettability on Ni substrate than on Cu substrate, while the Sn-Ag solder, i.e., [Sn11Ag2]Sn-3 has a better wettability on Cu substrate than on Ni substrate.