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发布时间：2019-03-14

论文类型：期刊论文

发表时间：2006-01-01

发表刊物：JOURNAL OF ELECTRONIC MATERIALS

收录刊物：EI、SCIE

卷号：35

期号：1

页面范围：181-188

ISSN号：0361-5235

关键字：electroless Ni-P; lead-free solder; aging; intermetallic compound (IMC); growth kinetics

摘要：A comparative study of solid/solid interfacial reactions of electroless Ni-P (15 at.% P) with lead-free solders, Sn-0.7Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu, and pure Sn, was carried out by performing thermal aging at 150 degrees C up to 1000 h. For pure Sn and Sn-3.5Ag solder, three distinctive layers, Ni3Sn4, SnNiP, and MY, were observed in between the solder and electroless Ni-P; while for Sn-0.7Cu and Sn-3.8Ag-0.7Cu solders, two distinctive layers, (CuNi)(6)Sn-5 and MY, were observed. The differences in morphology and growth kinetics of the intermetallic compounds (IMCs) at the interfaces between electroless Ni-P and lead-free solders were investigated, as well as the growth kinetics of the P-enriched layers underneath the interfacial IMC layers. With increasing aging time, the coarsening of interfacial Ni3Sn4 IMC grains for pure Sn and Sn-3.5Ag solder was significantly greater than that of the interfacial (CuNi)6Sn5 IMC grains for Sn-0.7Cu and Sn-3.8Ag-0.7Cu solders. Furthermore, the Ni content in interfacial (CuNi)(6)Sn-5, phase slightly increased during aging. A small addition of Cu (0.7 wt.%) resulted in differences in the type, morphology, and growth kinetics of interfacial IMCs. By comparing the metallurgical aspects and growth kinetics of the interfacial IMCs and the underneath P-enriched layers, the role of initial Cu and Ag in lead-free solders is better understood.