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论文类型： 期刊论文

发表时间： 2005-11-01

发表刊物： JOURNAL OF ELECTRONIC MATERIALS

收录刊物： SCIE、EI、Scopus

卷号： 34

期号： 11

页面范围： 1373-1377

ISSN号： 0361-5235

关键字： lead (Pb)-free solder; microstructure; creep; precipitation

摘要： This paper reports on the microstructure-creep property relationship of three precipitation-strengthened tin (Sn)-based lead (Pb)-free solder alloys (Sn-0.7Cu, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu) in bulk samples, together with Sn-37Pb as the alloy for comparison at temperatures of 303 K, 348 K, and 393 K. The creep resistance of these three Sn-based Pb-free solders increases, i.e., the steady-state creep rates decrease, with increasing volume fraction of precipitate phases for the Pb-free solder alloys. Their apparent stress exponents (n(a) similar to 7.3-17), which are all higher than that of pure Sn, attain higher values with increasing volume fraction of precipitate phases at constant temperature, and with decreasing temperature for the same solder alloy.