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论文类型： 期刊论文

发表时间： 2015-04-01

发表刊物： JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录刊物： SCIE、EI、Scopus

卷号： 26

期号： 4

页面范围： 2278-2285

ISSN号： 0957-4522

摘要： The tensile properties of Cu/Sn-9Zn/Cu solder interconnects with solder sizes of 200 and 300 mu m in three dimensions after aging and electromigration (EM) were investigated. The tensile strength decreased with increasing aging/EM time. During aging, the tensile strength was mainly determined by the strength of the solder and the fracture site tended to shift from the interface to the solder with increasing time. During EM, the tensile strength was mainly determined by the bonding strength of the interface and the fracture site tended to shift from the solder to the cathode interface with increasing time. Both tensile strength and fracture site were strongly related to the residual Zn content in the solder. The larger solder interconnects had a higher tensile strength due to a higher residual Zn content. The effect of solder size on failure mode of the Cu/Sn-9Zn/Cu solder interconnects after aging and EM was discussed.