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论文类型： 期刊论文

发表时间： 2014-07-25

发表刊物： JOURNAL OF ALLOYS AND COMPOUNDS

收录刊物： SCIE、EI、Scopus

卷号： 602

页面范围： 281-284

ISSN号： 0925-8388

关键字： Intermetallics; Crystal growth; Synchrotron radiation; Ag3Sn; Undercooling; Precipitation

摘要： Synchrotron radiation real-time imaging technology was used to in situ study the dissolution and precipitation behavior of Ag3Sn plates in sub-50 mu m Sn-4.0Ag-0.5Cu flip chip solder bumps on Ni-P under bump metallization (UBM). The dissolution rate of large Ag3Sn plates was as slow as 0.1-0.2 mu m/s at the heating stage, while the precipitation rate exceeded 5 mu m/s at the cooling stage with an undercooling of 31-55 degrees C. The random precipitation behavior of Ag3Sn plates was in situ observed and explained from the perspective of cluster. This study shows an effective method to investigate the microstructural evolution and the undercooling of phases in real ultra-fine solder joints. (C) 2014 Elsevier B. V. All rights reserved.