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论文类型： 期刊论文

发表时间： 2014-05-28

发表刊物： JOURNAL OF APPLIED PHYSICS

收录刊物： SCIE、EI、Scopus

卷号： 115

期号： 20

ISSN号： 0021-8979

摘要： Synchrotron radiation real-time imaging technology was carried out in situ to observe and characterize the effect of thermomigration on the growth behavior of interfacial intermetallic compounds (IMCs) in Cu/Sn/Cu solder joint during soldering. The thermomigration resulted in asymmetrical formation and growth of the interfacial IMCs. Cu6Sn5 and Cu3Sn IMCs formed at the cold end and grew rapidly during the whole soldering process. However, only Cu6Sn5 IMC formed at the hot end and remained relatively thin until solidification. The IMCs at the cold end were nearly seven times thicker than that at the hot end after solidification. The Cu dissolution at the cold end was significantly restrained, while that at the hot end was promoted, which supplied Cu atoms to diffuse toward the cold end under thermomigration to feed the rapid IMC growth. Moreover, the thermomigration also caused asymmetrical morphology of the interfacial IMCs at the cooling stage, i.e., the Cu6Sn5 IMC at the cold end transformed into facet structure, while that at the hot end remained scallop-type. The asymmetrical growth behavior of the interfacial IMCs was analyzed from the view point of kinetics. (C) 2014 AIP Publishing LLC.