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论文类型： 期刊论文

发表时间： 2014-05-01

发表刊物： JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录刊物： SCIE、EI

卷号： 25

期号： 5

页面范围： 2311-2319

ISSN号： 0957-4522

摘要： Sn-Zn-x(Al,Ag) near-eutectic solders, namely Sn-8.3Zn-0.73Ag, Sn-8.4Zn-0.44Al and Sn-7.4Zn-0.26Al-0.68Ag (in wt%) with melting points of 200.74, 198.00 and 197.32 A degrees C, respectively, as well as the Sn-9Zn eutectic solder, were used to join Al and Cu substrates. The addition of Ag led to the formation of dendritic AgZn3 phases, while the addition of Al obviously refined the microstructure of Sn-Zn eutectic, as well as the AgZn3 phases. The Sn-Zn-Al solder possessed the best wettability on both Cu and Al substrates among the four solders. Al4.2Cu3.2Zn0.7 intermetallic compound (IMC) layers formed at the Sn-Zn-x(Al,Ag)/Cu interfaces while Al-rich (Zn) solid solutions at the Sn-Zn-x(Al,Ag)/Al interfaces of all the as-soldered joints. The shear strength of the Al/Sn-Zn-Al/Cu solder joints was the highest among the four solder joints. The declining degree of the shear strength of the Sn-Zn-x(Al,Ag) solder joints in 3.5 % NaCl solution was in agreement with the corrosion-resistance order of the bulk solders. The Al/Sn-Zn-Ag/Cu joint thus owned the best corrosion resistance.