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论文类型： 期刊论文

发表时间： 2014-01-01

发表刊物： JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录刊物： SCIE、EI

卷号： 25

期号： 1

页面范围： 328-337

ISSN号： 0957-4522

摘要： The growth kinetics and morphology of the interfacial intermetallic compound (IMC) between Sn-3Ag-0.5Cu-xFe (x = 0, 0.5 wt%, 1 wt%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 A degrees C and then aged at 150 A degrees C. During soldering process, Fe particles quickly deposited in the vicinity of IMC, resulting in the formation of Fe-rich area. Isothermal equation of chemical reaction and phase diagrams were used to explain the effect of Fe on the growth kinetics of IMC during liquid-state interfacial reaction. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains after reflowing for 2 min while they were found in the other composite solders reflowing for about 30 min. The Fe tended to suppress the growth of the Cu3Sn layer during solid-state aging. However, the total thickness of IMCs (Cu6Sn5 + Cu3Sn) for the composite solders with Fe particles was similar to that for SnAgCu without Fe particles.