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发布时间：2019-03-09

论文类型：期刊论文

发表时间：2013-07-01

发表刊物：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录刊物：EI、SCIE

卷号：24

期号：7

页面范围：2624-2629

ISSN号：0957-4522

摘要：The interfacial microstructure and mechanical properties of a low melting temperature lead-free solder of In-18.75Bi-22.15Sn (in at.%) (In-Bi-Sn) were investigated. The microstructure analysis of bulk In-Bi-Sn revealed that irregular lamellar gamma-Sn phases distributed in the In2Bi matrix. There was only a single endothermic peak with an onset temperature of 62 degrees C on the DSC curve, indicating that In-Bi-Sn is close to a ternary eutectic solder. The ultimate tensile strength of the bulk In-Bi-Sn was 21.76 MP at a strain rate of 10(-2) s(-1) at 25 degrees C. The elongation of the bulk In-Bi-Sn solder reached 87 %, indicating an excellent ductility of the In-Bi-Sn solder. Two intermetallic compounds (IMCs), needle-like Cu(In,Sn)(2) and laminar Cu-6(In,Sn)(5), formed at the In-Bi-Sn/Cu interface. An IMC layer of polyhedral crystallites of InNi formed at the In-Bi-Sn/Ni interface. The shear strength of Cu/In-Bi-Sn/Cu solder joints was 21.15 MP, and the shear fractograph showed that the ductile fracture with dimples appearance occurred in the solder.