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论文类型： 期刊论文

发表时间： 2013-06-01

发表刊物： SCRIPTA MATERIALIA

收录刊物： SCIE、EI、Scopus

卷号： 68

期号： 11

页面范围： 853-856

ISSN号： 1359-6462

关键字： Reverse polarity effect; Cu/Sn-9Zn/Cu; Interfacial reaction; Effective charge number; Liquid solid electromigration

摘要： Synchrotron radiation real-time in situ imaging technology was used to study the interfacial reaction in Cu/Sn-9Zn/Cu interconnect during liquid solid electromigration. The reverse polarity effect, evidenced by the IMC layer at the cathode growing continuously while that at the anode was restrained, resulted from the directional migration of Zn atoms toward the cathode under electron current stressing, which is induced by the positive effective charge number of Zn atoms but not by the back-stress. The severe dissolution of Cu anode was explained theoretically. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.