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论文类型： 期刊论文

发表时间： 2010-10-01

发表刊物： JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录刊物： SCIE、EI、Scopus

卷号： 21

期号： 10

页面范围： 1046-1054

ISSN号： 0957-4522

摘要： In the present study, varying weight percentages of Y2O3 particles (3-5 mu m) from 0 to 3% were incorporated into eutectic Sn-Bi solder matrix to form composite solders. It is found that the reinforcement particles were well dispersed in the solder matrix. They depressed the growth of intermetallic compound (IMC) layers and reduced the size of IMC grains. Since the Y2O3 particles serve as additional nucleation sites for the formation of primary Bi-rich phase, the size of both Bi-rich phase and the IMCs were decreased gradually with the Y2O3 content increasing. Shear tests were also conducted on as-soldered joints. The growth of solid-state intermetallic compounds layer was examined by thermal aging of the solder/Cu couple for a temperature range from 60 to 120A degrees C and time periods from 50 to 500 h. Compared with Sn-58Bi solder, finer eutectic microstructures were obtained with Y2O3 addition after long time aging. The apparent activation energies calculated for the growth of the intermetallic compound layers were 72 +/- A 5 kJ/mol of Sn-58Bi, 74 +/- A 4 kJ/mol of Sn-58Bi-0.5wt%Y2O3, 81 +/- A 5 kJ/mol of Sn-58Bi-1wt% Y2O3 and 81 +/- A 7 kJ/mol of Sn-58Bi-3wt.% Y2O3, respectively.