- Corrosion of Sn-0.75Cu Solder and Sn-0.75Cu/Cu Joint in Salt Solutions
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- 论文类型： 会议论文
- 发表时间： 2011-08-08
- 收录刊物： EI、CPCI-S、Scopus
- 页面范围： 917-920
- 关键字： Corrosion; Solder alloy; Joint; Leaching behavior; Salt solutions
- 摘要： The corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl, 1%NaCl-2%Na2SO4 and 1%NaCl-0.6%Na2SO4-3%Na2CO3 solutions were investigated using leaching test. The leaching of Sn from the solder in 1%NaCl-0.6%Na2SO4-3%Na2CO3 solution was relatively serious, compared to that in the other two solutions. The amount of Sn leached from the joint was the largest in NaCl solution. Loosen corroded products formed on the surfaces of the solder or joint where a large amount of Sn leached. The XRD results showed that the corrosion products were mainly composed of SnO, SnO2 and Sn4(OH)6Cl2. The potentiodynamic polarization tests suggested that the galvanic corrosion which formed between solder alloys and Cu substrate was the main reason for the above differences.
