- Leaching of heavy metal elements in solder alloys
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- 论文类型： 期刊论文
- 发表时间： 2011-05-01
- 发表刊物： CORROSION SCIENCE
- 收录刊物： SCIE、EI
- 卷号： 53
- 期号： 5
- 页面范围： 1738-1747
- ISSN号： 0010-938X
- 关键字： Electronic materials; Tin; Acid corrosion; Alkaline corrosion
- 摘要： Leaching behavior of heavy metal elements from Sn-3.5Ag-0.5Cu, Sn-9Zn, and Sn-37Pb solder alloys and their joints was investigated in typical H(2)SO(4), NaCl and NaOH solutions. The leaching amount of Sn from solder joints was more than that from solder alloys and the leaching amount of Sn from Sn-3.5Ag-0.5Cu solder joint in the NaCl solution was the most. The surface corrosion products on the solder and their joints were composed of oxide, oxide hydroxide or oxychloride of the component element. Much more surface oxides for the samples treated in the NaCl solution produced than that in the NaOH and H(2)SO(4) solutions. (c) 2011 Elsevier Ltd. All rights reserved.
